DIP Soldering Production Machine For PCB Component Selective Soldering

                            DIP Soldering Production Machine For PCB Component Selective Soldering

                            DIP Soldering Production Machine For PCB Component Selective Soldering

                            DIP Soldering Production Machine For PCB Component Selective Soldering

                            DIP Soldering Production Machine For PCB Component Selective Soldering

DIP Soldering Production Machine For PCB Component Selective Soldering

DIP Soldering Production Machine For PCB Component Selective Soldering,JAGUAR,Electrical Equipment & Supplies,Electronics Production Machinery
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Description

Overview
Quick Details
Place of Origin:
Guangdong, China (Mainland)
Brand Name:
JAGUAR
Model Number:
OS-400C
Name:
DIP Soldering Production Machine For PCB Component Selective Soldering
Machine size:
L850mm *W1100mm * H1340mm
Weight:
200kg
Max soldering size:
400*400mm
Fixture max size:
420*420mm
PCB thickness:
0.2-6mm
PCB board edge size:
Over 3mm
PCB put and take:
manual
lead screw:
grinding lead screw
Control system:
PID
Packaging & Delivery
Packaging Details
wooden box
Delivery Time
in 20 days

DIP Soldering Production Machine For PCB Component Selective Soldering

DIP Soldering Production Machine For PCB Compo<em></em>nent Selective Soldering

Product Description

Work process:

Manual put down plate---spray flux--- pcb move to preheating--- pcb selective soldering---take away pcb

Futures:

1.Full function offline machine with small occupation.

2.PCB moved, spray and soldering platform fixed.

3.High quality soldering.

4.Machine could be placed on a production line, easy to set up a new line.

5.PC control, parameters could be set and saved in the computer. All data can be traced back and store.

Machine detailed show:

DIP Soldering Production Machine For PCB Compo<em></em>nent Selective Soldering

Component 1: Machine software system

1. With completely independent Intellectual property rights of soldering software,combined with many years selective soldering skill and experience, based on the development of the Window software function, machine will be more easy to operate and good traceability.

2.the PCB scanning images can be used for the path programming, the path to the starting point, the welding speed, idle motion speed, height of Z axis, wave height, etc. can be set on the computer.

3.the real-time display of welding process. Through the camera, the welding process can give the feedback to the machine external independent display.

4.can be upgraded to take MARK point positioning and the frequency of use.

Component 2: motion platform system:

1.main motion platform design with lightweight, improve the running speed and make sure the platform rigidity.

2.Panasonic servo driver and motor provided with power for the movement. grinding lead screw and linear guide make the direction so that with advantages positioning precision, low noise, smooth movement.

3.Motion platform with dust shield in order to prevent the dirt drop into the lead screw.

Component 3: Spray Part

1. Nozzle adopt Japanese origin spray nozzle with advantages of good spray effect, not easy to blockage and suitable for various flux.

2. Flux use pressure tank storage made sure the spary pressure stable. Reduce the bad affect by the quantity of flux.n

Component 4: Preheating Part

1. IR(infrared) heating, position can be adjustable.

2.heating rate can adjust by the computer.

Component 5: selective solder part

1.Solder pot temperature, Nitrogen temperature, wave height ect can be set by computer.

2.Solder tank is made of alloy. External type heating plate, uniform heat transfer.

3.solder pot adopt flexible connection wires, make sure no need to rewiring when we change another pot.

4.Nitrogen on-line heating devices ensure good wettability and reduce oxide.

5.Solder pot is with liquid level alarm system.

Component 6: PCB put down and take out

1.Manual put down and take out

2.PCB fix position by the clamp device

Component 7. Machine Shell

1.The whole steel structure, added the base board at the bottom in order to increase the stability and reduce the shaking.

2.Machine surface use industrial paint.

Specification:

Model Number

OS-400C

General

Machine size

L850mm X W1100mm X H1340mm

Total power

5KW

Running power

1-3kw

Weight

200kg

Air requirement

3-5 Bars 8-12L/min

Nitrogen requirement(option)

3-4 bars over 2m2/h

Nitrogen purity requirement(option)

99.998%

Pumping air volume requirements

500-800cmb/h

Fixture and PCB

Fixture

Can be used if needed

Fixture max size

420*420mm

Max soldering size

400*400mm

PCB thickness

0.2-6mm

PCB board edge size

Over 3mm

Control system and operation

Control method

PC

PCB put and take

manual

Operate height

900±30mm

Component max height

Up 50mm/ bottom 30mm

Motion platform

Motion axis

X Y Z

Motion control

Close loop servo control

Motion motor

Panasonic motor and servo

Position accuracy

±0.1mm

lead screw

grinding lead screw

Rosin Flux Control

Spray Nozzle

Japanese origin spray nozzle

Spray durability

Stainless steel

Flux capacity

1L

Flux container

pressure tank

alcohol capacity

1L

alcohol container

pressure tank

Heating Part

Heating method

IR

Heating power

3kw

Tempt. range

25-240

Solder pot part

Solder pot quantity

1

Solder capacity

15kg

Control system

PID

Melting time

20-30mins

Packaging & Shipping

 DIP Soldering Production Machine For PCB Compo<em></em>nent Selective Soldering

Our Services

 DIP Soldering Production Machine For PCB Compo<em></em>nent Selective SolderingDIP Soldering Production Machine For PCB Compo<em></em>nent Selective Soldering

Company Information

 DIP Soldering Production Machine For PCB Compo<em></em>nent Selective SolderingDIP Soldering Production Machine For PCB Compo<em></em>nent Selective SolderingDIP Soldering Production Machine For PCB Compo<em></em>nent Selective Soldering

Contact Info:

Demi

Shenzhen Jaguar Automation Equipment Co.,Ltd.

 

 Tel:+86-755-23316315

 Mob, Wechat, Skype: +86-13925751224